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Exhibition Outline

Exhibition Title 28th ELECTROTEST JAPAN
Held within NEPCON JAPAN × ELECTRONIX R&D JAPAN
  - 40th INTERNEPCON JAPAN
  - 12th IC PACKAGING TECHNOLOGY EXPO
  - ELE TRADE–12th International Electronic Components Trade Show
  - PWB EXPO–12th Printed Wiring Boards Expo
  - MATERIAL JAPAN–2nd Advanced Electronic Materials Expo
  - MicroTech JAPAN–1st Micro Fabrication / Fine Process Technology Expo
Concurrent Shows CAR-ELE JAPAN–3rd Int'l Automotive Electronics Technology Expo
EV JAPAN–2nd EV & HEV Drive System Technology Expo
1st Automotive Lightening Technology Expo
LIGHTING JAPAN–3rd LED/OLED Lighting Technology Expo
Dates January 19 (Wed) - 21 (Fri), 2011
Venue Tokyo Big Sight, Tokyo, Japan
Concurrent Events INTERNEPCON / ELECTROTEST Technical Conference
Special Zones Image Processing Zone
Organised by Reed Exhibitions Japan Ltd.
Services included in
the exhibit price
  • Exhibit Raw Space (excluding display system cost such as the walls, carpet, etc.)
  • Free Invitation Tickets
  • Special VIP Customers Invitation System
  • Free promotion of exhibition by press released to industry's prominent publication / magazines
  • Publishing of your exhibiting information on official website
  • Publishing of your company name & exhibiting information in "Floor Plan" & "Official Web Directory" which are distributed to all visitors

*Other services to increase your exhibiting effect are also available.
Visitor Profile Experts & professionals involved in the wide range of fields related to Electronics Manufacturing
  • Home Appliances
  • Personal Computer Peripheral / Office Devices
  • Audio / Visual Devices
  • Test / Inspection Equipment
  • Semiconductor Assembly
  • Automobile-related Devices
  • Optical Instrument
  • Mobile Communication Systems Devices
  • Industrial Control / Factory Automation
  • Transportation Equipment
  • Medical Devices and Others  etc.
Exhibit Profile
  • Board Vision Inspection Equipment
  • Solder Vision Inspection Equipment
  • Infrared Test Equipment
  • X-ray Inspection Equipment
  • Ball Machine Vision Inspection Equipment
  • TAB Vision Inspection Equipment
  • Bump Vision Inspection Equipment
  • IC / PCB / Components Vision Inspection Equipment
  • Lead Frame Vision Inspection Equipment
  • BGA / CSP Rework System / Equipment
  • Boundary-scan Testers
  • In-Circuit Testers
  • Functional Solder Testers
  • Testing Sockets for BGA, CSP
  • IC / LSI Testers
  • Bare Board Testers
  • Inspection jig / Test Fixtures / Probes / Testing Stages
  • Burn-in Equipment
  • 2-D / 3-D Inspection Equipment
  • Film Thickness Measurement Equipment
  • Environmental Test Equipment
  • Reliability / Evaluation Inspection Equipment
  • Analysis Equipment / Software
  • Various Measurement / Inspection / Analysis Devices
  • Other Various Testers, Inspection, Measurement Equipment and Devices
  • Contract Analysis Services
  • CCD Cameras / Other Cameras for Testing
  • Lenses
Image Processing Zone
  • Spectral Source for Image Processing
  • Image Processing Unit / System
  • Boards for Image Processing
  • Software for Image Processing / Analysis
  • Monitors / Displays
  • Printers
  • Other Related Equipment and Parts
Contact Us ELECTROTEST JAPAN Show Management
Attn: Hajime Suzuki (Mr.), Kanako Otsuka (Ms.), Taikoku Kin (Mr.)
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL: +81-3-3349-8502  FAX: +81-3-3349-4900
E-mail: inw@reedexpo.co.jp
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